| SMT-assemblage ynklusyf BGA-assemblage | |
| Akseptearre SMD-chips | 01005, BGA, QFP, QFN, TSOP |
| Komponenthichte | 0.2-25mm |
| Min ynpakking | 0201 |
| Min ôfstân tusken BGA | 0,25-2,0 mm |
| Min. BGA-grutte | 0.1-0.63mm |
| Min QFP-romte | 0,35 mm |
| Min. gearstallingsgrutte | (X*Y) 50*30mm |
| Maksimale gearstallingsgrutte | (X*Y) 350*550mm |
| Presyzje fan pick-placement | ±0,01 mm |
| Pleatsingsmooglikheid | 08:05, 06:03, 04:02, 02:01 |
| Perspassing mei hege pintelling beskikber | |
| SMT-kapasiteit per dei | 2.000.000 punten |
| FOB-poarte | Shenzhen |
| HTS-koade | 8509.90.00 00 |
| Trochrintiid | 15–30 dagen |