SMT-assemblage ynklusyf BGA-assemblage | |
Akseptearre SMD-chips | 01005, BGA, QFP, QFN, TSOP |
Komponenthichte | 0.2-25mm |
Min ynpakking | 0201 |
Min ôfstân tusken BGA | 0,25-2,0 mm |
Min. BGA-grutte | 0.1-0.63mm |
Min QFP-romte | 0,35 mm |
Min. gearstallingsgrutte | (X*Y) 50*30mm |
Maksimale gearstallingsgrutte | (X*Y) 350*550mm |
Presyzje fan pick-placement | ±0,01 mm |
Pleatsingsmooglikheid | 08:05, 06:03, 04:02, 02:01 |
Perspassing mei hege pintelling beskikber | |
SMT-kapasiteit per dei | 2.000.000 punten |
FOB-poarte | Shenzhen |
HTS-koade | 8509.90.00 00 |
Trochrintiid | 15–30 dagen |